​TOP TECH SUBSTRATES CO., LTD

​TOP TECH SUBSTRATES CO., LTD

UV Release Film for Semiconductor Manufacturing

2026 05/30

UV Release Film for Semiconductor Manufacturing
Specifically designed for the semiconductor industry, our UV Release Film is an indispensable material for wafer fabrication. It is primarily used in wafer back-grinding and dicing processes, providing secure temporary fixation for ultra-thin wafers. The film's high adhesion prevents chipping or movement during precision cutting. Once processing is complete, UV irradiation neutralizes the adhesive force, allowing clean separation without damaging delicate dies. It is compatible with automated production lines, significantly improving yield and efficiency in IC, LED, and discrete semiconductor device manufacturing.
UV Release Film for Semiconductor Manufacturing