​TOP TECH SUBSTRATES CO., LTD

​TOP TECH SUBSTRATES CO., LTD

Conductive Thermal Conductive PP Film: Advanced Material for Thermal Management and EMI Shielding

2025 08/06

Conductive Thermal Conductive PP Film: Advanced Material for Thermal Management and EMI Shielding
 
Introduction
Conductive thermal conductive polypropylene (PP) film is a high-performance engineered material PE Release Film for Electronics Industry!  designed to address both heat dissipation and electromagnetic interference (EMI) challenges in modern electronics, automotive, and energy storage applications. This multifunctional film combines PP's lightweight flexibility with enhanced thermal and electrical conductivity, PE Release Film for Packaging Industry  offering a unique solution for thermal management in compact electronic designs.
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Key Performance Characteristics
Thermal Conductivity
 
In-plane thermal conductivity: 5-15 W/m·K
 
PE Release Film for Medical lndustry Through-plane thermal conductivity: 1-3 W/m·K
 
Thermal resistance: <0.5 °C·cm²/W
 
Electrical Conductivity
 
Surface resistivity: 10²-10⁵ Ω/sq
 
Volume resistivity: 10³-10⁶ Ω·cm
 
EMI shielding effectiveness: 30-60 dB (1-10 GHz)
 
Material Properties
 
Thickness range: 25-300 μm
 
Tensile strength: 80-150 MPa
 
Operating temperature: -40°C to 130°C
 
Dielectric strength: ≥15 kV/mm
 
Technology Integration
Conductive Network Design
 
PE Release Film for Construction Industry Hybrid filler system (carbon nanotubes + boron nitride)
 
Percolation threshold optimization (3-8 vol%)
 
Anisotropic thermal pathway engineering
 
Advanced Manufacturing
 
Multi-layer coextrusion with conductive core
 
Precision calendering for filler alignment
 
Plasma surface functionalization
 
Manufacturing Process
Compounding
 
Twin-screw extrusion with high shear mixing
 
Masterbatch preparation (40-60% filler loading)
 
Film Formation
 
Cast film process with controlled cooling
 
Biaxial orientation for property enhancement
 
Post-treatment
 
Corona treatment for adhesion improvement
 
Laser trimming for dimensional accuracy
 
Applications
Consumer Electronics
 
Smartphone/tablet heat spreaders
 
LED backlight thermal management
 
Energy Storage
 
Lithium-ion battery interlayer
 
Supercapacitor component
 
Automotive Electronics
 
Power module insulation
 
EV battery thermal interface
 
5G Infrastructure
 
Antenna heat dissipation
 
RF shielding components
 
Quality & Compliance
UL 94 V-0 flame rating
 
IEC 62368-1 safety standard
 
RoHS/REACH compliant
 
ASTM D5470 thermal testing
 
This advanced material enables thinner, lighter thermal solutions while providing essential EMI protection in next-generation electronic designs.
 
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Key Advantages:
 
50% weight reduction compared to metal heat spreaders
 
Excellent balance between thermal/electrical performance
 
Maintains PP's inherent chemical resistance
 
Enables flexible thermal management solutions
 
Cost-effective alternative to traditional materials